SX2KL-33F200E-32.768KHz,2520mm,FCD-Tech數字設備晶振,CMOS振蕩器特點:
超小型封裝有源晶振
高抗沖擊/振動性(半導體工藝)
擴展可用的溫度范圍,非常快速地啟動
定制頻率0.5Hz至500MHz
應用:便攜式電子產品.
SX2KL-33F200E-32.768KHz,2520mm,FCD-Tech數字設備晶振,CMOS振蕩器 參數表
| Item |
Speci?cation 32.768 kHz (please consult factory for custom make frequency 0.5 Hz - 500 MHz) |
|||||||
| Frequency Range | 32.768 kHz (please consult factory for custom make frequency 0.5 Hz - 500 MHz) | |||||||
| Output Logic | CMOS | |||||||
| Overall Frequency Stability * | ± 200 ppm typ . ~ ± 500 ppm max | |||||||
| Operating Temperature Range | -20 ~ +70°C | |||||||
| Supply Voltage Vdd | +3.3V ±5% | |||||||
| Supply CurrentIdd | 15 µA max | |||||||
| Output Level | VOH ≥ 0.9 VddVOL ≤ 0.1 Vdd | |||||||
| Output Load | 15 pF | |||||||
| Symmetry | 45 / 55 % | |||||||
Rise Time / Fall Time
|
20 ns max | |||||||
| Tri-state function |
pin #1 = high or open pin #1 = low |
pin #3 ==>oscillation pin #3 ==>high impedance |
||||||
| Start-up Time | 1 ms max. | |||||||
| Shock resistance | 20000GS | |||||||
|
Packing Unit |
||||||||
Soldering Condition
|
||||||||
SX2KL-33F200E-32.768KHz,2520mm,FCD-Tech數字設備晶振,CMOS振蕩器尺寸圖



Rise Time / Fall Time
Soldering Condition




FCD-Tech差分晶振,LVDS,SX3LK-33F20-125MHZ,3225mm,125MHZ低抖動晶振
NKG有源晶振,7050mm,SCO36B40.000MTS-EXT,SCO3系列,40MHZ
SX5C-33F20EH-100MHZ,5032mm,CMOS,FCD-Tech微波雷達晶振,SX5C系列
DSC8001BCE1-T,5032mm,CMOS振蕩器,Microchip有源晶振
DSC1018,DSC1018DI1-019.2000,19.2MHz,2520mm,Microchip有源晶振
EC2600TS-75.000M,EC26,7050mm,Ecliptek石英晶體振蕩器
C3291-24.000,Crystek四腳貼片晶振,24MHz,低相位噪聲晶振
ABDFTCXO-50.000MHZ-E-2-CT,Abracon晶體振蕩器,低功耗晶振
DSC1003DE1-048.0000T,2520mm,Microchip貼片晶振,監控攝像頭晶振